| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus which can improve in-plane uniformity of temperature distribution on a substrate during heat treatment. SOLUTION: A light is directed from a first light irradiation part 3 to a substrate W held onto a holding part 2, so as to apply primary heat treatment, and a flash light is given from a second light irradiation part 4 thereto for flash heating. A part of light emitted from the light irradiation parts 3 and 4 is reflected on a reflection plate 11a, and it arrives at a semiconductor wafer W. An attitude change mechanism 111a is connected to each reflection plate 11a, so as to change the posture of the respective reflection plate 11a. Changing of the posture of the reflection plate 11a can reduce (or increase) a flux of light entering a specific area of the semiconductor wafer W. Thus, an area wherein ununiformity in temperature occurs in the substrate W can be eliminated. COPYRIGHT: (C)2009,JPO&INPIT
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