| 摘要 |
Electrical components (402, 504, 506) are placed on a carrier (508). Then the components are encapsulated in an electrically insulating material (404). The carrier (508) is removed and the leads (414) of the encapsulated components are registered to intermediate connectors (412) in a central bonding, or joining, material (406) and to respective leads (410) of a printed circuit board (408). The components, central bonding material, and printed circuit board are then joined and interconnected. |
