CHEMICAL-MECHANICAL PLANARIZATION PAD HAVING END POINT DETECTION WINDOW
摘要
<p>A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.</p>
申请公布号
WO2009070352(A1)
申请公布日期
2009.06.04
申请号
WO2008US71074
申请日期
2008.07.24
申请人
INNOPAD, INC.;LEFEVRE, PAUL;HSU, OSCAR K.;WELLS, DAVID ADAM;ALDEBORGH, JOHN ERIK;JIN, MARC C.
发明人
LEFEVRE, PAUL;HSU, OSCAR K.;WELLS, DAVID ADAM;ALDEBORGH, JOHN ERIK;JIN, MARC C.