SPUTTERING APPARATUS, AND FILMING METHOD

摘要

This aims to provide a sputtering apparatus for forming a film on the surface of a substrate. The sputtering apparatus comprises a table for mounting the substrate, a plurality of targets arranged to have their center axes inclined with respect to the normal line of the substrate mounted on the table, and a plurality of magnetic-field applying means interposed between the individual targets and the substrate in a manner to enclose the substrate. These magnetic field applying means generate a magnetic field having a parallel magnetic-field component parallel to the surface of the substrate, over the peripheral edge of the substrate.