| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, and the semiconductor device that offers high bonding reliability and that has projecting electrodes (bump electrodes) on a semiconductor element. <P>SOLUTION: A support substrate having a plurality of first recessions and second recessions formed in the first recessions is provided (step S1), after which first electrode layers are disposed in the second recessions (step S2). The semiconductor element having a plurality of second electrode layers is then brought closer to the support substrate (step S3). Subsequently, while the second electrode layers are received in the first recessions of the support substrate under a heat treatment, part of the first electrode layers is inserted in the second electrode layers (step S4). Finally, the first and second electrode layers are cooled to separate the support substrate from the first and second electrode layers (step S5). <P>COPYRIGHT: (C)2009,JPO&INPIT |
