| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-density packaging system capable of being integrated at high density simply, quickly and efficiently, without performing complicated manufacturing treatment. <P>SOLUTION: A semiconductor device does not include a molded body or package. The semiconductor device includes a substrate (12) and a die (11) coupled to the substrate. The die is coupled to the substrate such that the source and gate regions of the die, assuming a MOSFET-type device, are coupled to the substrate. Solder balls (13) are provided adjacent to the die such that when the semiconductor device is coupled to a printed circuit board, the exposed surface serves as the drain connections, while the solder balls serve as the source and gate connections. <P>COPYRIGHT: (C)2009,JPO&INPIT |
