发明名称 COMPOSITE MATERIAL LIQUID FOR FORMING METAL FILM, METAL COMPOUND FILM USING THE SAME, METAL/METAL COMPOUND FILM, AND COMPOSITE MATERIAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide composite material liquid for forming a metal film with low resistance having no cracks after sintering and no fusion in solution without using a surface finishing agent essential to anti-oxidation, fusion-proof, and dispersion of metal minute particles, a metal compound film used for the composite material liquid for forming a metal film, a composite material, and the metal film made by reducing the metal compound film or the metal compound film. <P>SOLUTION: The composite material liquid for forming a metal film includes metal minute particles having an average diffusion particle size of 500 nm or below and having a core/shell structure wherein the center section is made of a metal and the surface section is made of a metal oxide. It is preferable as the metal minute particles that the metal minute particles include essential components formed by a process of dispersing the metal compound into an organic solvent, and then, a process of irradiating a laser beam on the metal compound in the organic solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009123674(A) 申请公布日期 2009.06.04
申请号 JP20080076233 申请日期 2008.03.24
申请人 HITACHI CHEM CO LTD 发明人 KAMISHIRO YASUSHI;NAKAKO TAKEO;YAMAMOTO KAZUNORI;YOKOZAWA SHUNYA;MACHII YOICHI;EJIRI YOSHINORI;MASUDA KATSUYUKI
分类号 H01B1/22;C09D11/00;C09D11/30;C09D11/52;H01B1/00;H01B5/14;H01B13/00;H05K1/09;H05K3/10;H05K3/12 主分类号 H01B1/22
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