| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device which can suppress reduction in heat radiation, while aiming at suppression of size reduction, and improve high-speed response. SOLUTION: The semiconductor laser device 1 includes a header 6; a submount 7 attached to the header 6; a semiconductor laser element portion 8 mounted on the submount 7; and a lead 3. In the semiconductor laser device 1, when the emission direction of a laser beam from a semiconductor laser element portion 8 is an arrow mark Z1 (front side), a first front end 3a of the lead 3 is arranged in the arrow mark Z2 direction (rear side) beyond a surface 7a on the side of the arrow mark Z2 (rear side) of the submount 7, and an electrode 7c electrically connected to the semiconductor laser element portion 8 of the submount 7 is connected to the front end 3a of the lead 3 by means of an Au wire 100. COPYRIGHT: (C)2009,JPO&INPIT
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