| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a Cu alloy film for a display device that has a lower electric resistivity than a conventional Cu alloy film, can realize direct connection of low contact resistance to transparent conductive films without forming any barrier metal, and, when applied to a liquid crystal display or the like, can provide a high display quality. <P>SOLUTION: The Cu alloy film for a display device comprising films 25, 26, 34 is directly connected to transparent conductive films 5, 41 on the substrate, and contains 0.1 to 0.5 atom% of Ge and 0.1 to 0.5 atom% in total of one kind or more selected from a group comprising Ni, Zn, Fe and Co. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
