发明名称 HEATING DEVICE FOR SOLDERING, AND ITS METHOD
摘要 PROBLEM TO BE SOLVED: To provide a heating device for soldering which effectively rises a temperature up to a soldering temperature region, even if an object to be soldered includes many nonmagnetic and low resistant materials such as aluminum, and to provide its method. SOLUTION: The heating device for soldering includes a matching variable transformer 10, a primary side circuit which applies a fluctuating voltage to a primary side coil 11 of the matching variable transformer 10, a secondary side circuit connected to a secondary side coil 12 of the matching variable transformer 10, a heating coil 15 provided at the secondary side circuit, a resonant capacitor 19, and a slider to introduce the object to be soldered into the heating coil 15. In the heating device for soldering, the fluctuating voltage is applied to the primary side coil 11 of the matching variable transformer 10, while matching impedance by adjusting the matching variable transformer 10, by which the object to be soldered in the heating coil 15 is heated by induction heating, and is soldered. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009119510(A) 申请公布日期 2009.06.04
申请号 JP20070298332 申请日期 2007.11.16
申请人 TOYOTA MOTOR CORP;HIRATA CORP 发明人 MATSUURA MASAYA;KUBOTA TOMOYUKI;HIRAKAWA TAKENORI;MURAKAMI DAISAKU
分类号 B23K1/002;B23K103/10;H05B6/04;H05B6/10 主分类号 B23K1/002
代理机构 代理人
主权项
地址