| 摘要 |
PROBLEM TO BE SOLVED: To provide a mask substrate and its manufacturing method which can control a surface defect caused by the contact of the surface to be worked, suppress the deformation of the mask substrate, form a micro pattern with high precision, and make productivity excellent. SOLUTION: The mask substrate 1 is formed of silicon for protecting parts other than the worked part of the substrate. The surface side touching the substrate to be worked has a contact surface side orifice 2 which is formed in a configuration corresponded to a worked part configuration by an anisotropy dry etching, and a recess 4 which is formed independently of the contact surface side orifice and formed so as not to contact with the predetermined parts other than the worked part. In the surface side opposite to the surface contacting the substrate to be worked, a wall surface is formed of the silicon which is left behind along a predetermined crystal face bearing by anisotropy wet etching, and an exterior surface side orifice 3 communicating with the contact surface side orifice is for, and the sidewall thickness a of the contact surface side orifice 2 is made thicker than the depth b of the recess 4. COPYRIGHT: (C)2009,JPO&INPIT
|
