| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of joining a cap formed of a material not allowing dry dicing to a semiconductor wafer formed with a functional element, with high mounting precision, by structure not sealed air-tightly. SOLUTION: This method has a process for forming a groove 2 on a junction face to a cap forming wafer 8 of a wafer support member 9, a process for joining the wafer support member to the cap forming wafer 8, a process for forming a cut-in in a position of the groove 2, in the cap forming wafer 8, a process for joining the cap forming wafer 8 to the semiconductor wafer 11, and a process for dicing the semiconductor wafer 11 and the wafer support member 9 in the position of the groove position 2. COPYRIGHT: (C)2009,JPO&INPIT
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