发明名称 SEMICONDUCTOR ASSEMBLY AND METHOD FOR PRODUCING A SEMICONDUCTOR ASSEMBLY
摘要 A semiconductor assembly with at least one support comprises at least two planar pn junctions that are attached to the support in at least one level in such a manner that p and n sides of different pn junctions are alternately closer to the top of the support. Planar conductor assemblies are attached partly above and partly below the level of the pn junctions. A suitable arrangement and design of pn junctions and conductor assemblies results in at least one functional electric series connection of the pn junctions. This arrangement allows a large-surface and homogeneous, high luminosity lighting device to be designed in an uncomplicated and flexible manner and oftentimes required complex planar optical waveguides to be simplified or avoided. The invention also relates to a method for producing said semiconductor assembly, comprising the steps of producing pn junctions, producing electric conductor assemblies and arranging the pn junctions. Said method allows an efficient and cost-effective production of the semiconductor assembly.
申请公布号 WO2009067991(A2) 申请公布日期 2009.06.04
申请号 WO2008DE01912 申请日期 2008.11.19
申请人 OSRAM OPTO SEMICONDUCTORS GMBH;HERRMANN, SIEGFRIED 发明人 HERRMANN, SIEGFRIED
分类号 H01L27/32;H01L27/15;H01L33/00;H01L33/62 主分类号 H01L27/32
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