| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency module which is free of deterioration in characteristic impedance even when a general electronic component is used in a microwave high-frequency band. <P>SOLUTION: The high-frequency module includes an insulating substrate 1 having a ground conductor 2, microwave transmission lines 3a and 3b pattern-formed extending on a surface of the insulating substrate and having a slit 3, a ground pattern 4 extending along the transmission lines while leaving a gap 6, an electric connection means 5 of electrically connecting the ground pattern and ground conductor to each other, a first electronic component having electrodes installed at both ends of the transmission lines disposed at the slit, a second electronic component having one electrode connected to the transmission lines across an input-side gap of the first electronic component and the other electrode connected to the ground pattern, and a third electronic component having one electrode connected to the transmission lines across an output-side gap of the first electronic component and the other electrode connected to the ground pattern, the distance between the transmission lines and ground conductor being substantially equal to the distance between the transmission lines and ground pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT |
