| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machine which can reduce the number of scans of a machined product having a width in the thickness direction and can shorten a machining time. <P>SOLUTION: In a laser beam machine 10 for making laser light L incident on a surface of a wafer W to form a reformed region P in the wafer W and dividing the wafer W into individual chips, the laser beam machine 10 is characterized by including a laser head 40 for emitting the laser light L to the wafer W. The laser head 40 includes a laser oscillator 21, a condenser lens 24 for condensing the oscillated laser light L, and a vibrating means 27 for slightly moving the laser light L perpendicularly to the wafer W. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
