| 摘要 |
PROBLEM TO BE SOLVED: To accurately polish the height of an MR element also in polishing in which the resistance value of the MR element is measured, and improve the polishing accuracy of a magnetic head including a magnetic layer with respect to a work material. SOLUTION: The lapping device mounts on a lap surface plate 61 a row bar 70 including the magnetic layer, whose magnetic vector direction is changed by application of an external magnetic field, and carries out polishing of the row bar 70 while pressing the row bar 70 against the rotating lap surface plate 61 by a pressing mechanism 10. A magnetic field applying means 15 for applying a magnetic field in one direction to the magnetic layer of the row bar 70 is disposed on a face opposed to the lap surface plate 61 of the pressing mechanism 10. The lapping device carries out the polishing while applying a magnetic field in a predetermined direction to the magnetic layer of the row bar 70. COPYRIGHT: (C)2009,JPO&INPIT |
