| 摘要 |
PROBLEM TO BE SOLVED: To easily and surely provide a molded article with an IC tag embedded. SOLUTION: A molding method of molding the molded article by filling melted resin into a cavity of a mold from a nozzle at the tip of a heating cylinder comprises filling the non-contact type IC tag to which heat resistant coating is performed, together with the melted resin into the cavity to mold the molded article with the built-in IC tag. COPYRIGHT: (C)2009,JPO&INPIT |
