发明名称 HEAT TREATMENT APPARATUS, AND HEAT TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, capable of strictly detecting an abnormality in heat treatment. SOLUTION: An integrated value of the difference between the surface temperature of a baking plate measured when a substrate is placed on the baking plate and a set temperature is calculated. When a substrate having a temperature close to a normal temperature is exactly placed on a predetermined position of the surface of the baking plate, heat transfer from the surface of the baking plate to the substrate immediately occurs, and the temperature of the substrate rises rapidly and the surface temperature of the baking plate temporally decreases. However, in such a case where the substrate is placed to be inclined, the quantity of heat transfer from the baking plate to the substrate is small and the degree of a decrease in the surface temperature of the baking plate is small, and the integrated value is small. As a result, if the calculated integrated value is not more than a threshold value, it is determined that an abnormality occurs in heat treatment. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009123816(A) 申请公布日期 2009.06.04
申请号 JP20070294344 申请日期 2007.11.13
申请人 SOKUDO:KK 发明人 NAKANO NOBUYUKI
分类号 H01L21/027;H01L21/31 主分类号 H01L21/027
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