| 摘要 |
PROBLEM TO BE SOLVED: To improve quality by preventing substrates from being electrically charged in taking out the bonded two substrates from the lower stage, in an apparatus and method for bonding substrates. SOLUTION: The apparatus 10 for bonding substrates has a means to reduce areas of contact between upper and lower substrates 1, 2 and upper and lower stages 21, 22, after bonding the upper substrate 1 and the lower substrate 2 to each other and before resetting the internal pressure in the vacuum chamber 11 to the atmospheric pressure. COPYRIGHT: (C)2009,JPO&INPIT
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