发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve reproducibility and reliability of processing performance by lessening as much as possible an RF power loss in a filter circuit for attenuating noise of unwanted high frequencies and machine differences (variations among devices). <P>SOLUTION: In a plasma etching device, two-system first-step air-core coil simple bodies A(1), A(2) provided on first and second power-feeding lines are concentrically mounted on a bobbin 114A. That is, coil conducting wires constituting the both air-core coil simple bodies A(1), A(2) are spirally wound around in equal winding lengths along an outer periphery face of the common bobbin 114A as they progress in parallel superposed in a bobbin axis direction. Likewise, second-step air-core coil simple bodies B(1), B(2) have their coil conductive wires spirally wound around in equal winding lengths along an outer periphery face of the common bobbin 114B as they progress in parallel superposed in a bobbin axis direction. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009123505(A) 申请公布日期 2009.06.04
申请号 JP20070295755 申请日期 2007.11.14
申请人 TOKYO ELECTRON LTD 发明人 YAMAZAWA YOHEI;OKUNISHI NAOHIKO
分类号 H05H1/46;H01L21/205;H01L21/3065 主分类号 H05H1/46
代理机构 代理人
主权项
地址