| 发明名称 |
MICROELECTROMECHANICAL SYSTEM |
| 摘要 |
A microelectromechanical system comprises a carrier substrate. A semiconductor chip is fitted in the carrier substrate or on the carrier substrate. In addition, a microelectromechanical component is fitted to the carrier substrate. The microelectromechanical component is arranged at least partly above the semiconductor chip.
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| 申请公布号 |
US2009141913(A1) |
申请公布日期 |
2009.06.04 |
| 申请号 |
US20080324864 |
申请日期 |
2008.11.27 |
| 申请人 |
MAUER MICHAEL;HEISS HEINRICH |
发明人 |
MAUER MICHAEL;HEISS HEINRICH |
| 分类号 |
H04R19/04;H01L21/58;H01L29/84 |
主分类号 |
H04R19/04 |
| 代理机构 |
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代理人 |
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