发明名称 SUBSTRATE TREATING APPARATUS WITH INTER-UNIT BUFFERS
摘要 The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.
申请公布号 US2009142162(A1) 申请公布日期 2009.06.04
申请号 US20080324794 申请日期 2008.11.26
申请人 SOKUDO CO., LTD. 发明人 OGURA HIROYUKI;MITSUHASHI TSUYOSHI;FUKUTOMI YOSHITERU;MORINISHI KENYA;KAWAMATSU YASUO;NAGASHIMA HIROMICHI
分类号 H01L21/67 主分类号 H01L21/67
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