| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element package and a light emitting device, capable of obtaining a sufficient heat radiation effect by simple structure, capable of enhancing a taking-out efficiency of light, capable of compactifying the whole device, and capable of restraining a manufacturing cost in a low level. <P>SOLUTION: This light emitting element package of the present invention is provided with a light emitting element 11, and a resin base material layer 15 having the first pattern metal part 152 connected electrically to an electrode part of the light emitting element 11, and the second pattern metal part 153 connected electrically to the first pattern metal part 152, a metal penetrated-through part 15a is provided in the resin base material layer 15 to be penetrated through the resin base material layer 15, the light emitting element 11 is mounted on the metal penetrated-through part 15a, and a thickness of the second pattern metal part 153 is set to 50 μm or less. <P>COPYRIGHT: (C)2009,JPO&INPIT |
