| 摘要 |
PROBLEM TO BE SOLVED: To resolve a problem that high accuracy process of a joint surface of a heating element and a radiating element is required for reducing a thermal resistance between the heating element and the radiating element in a conventional joint structure of the heating element and the radiating element, and as a result, the processing step becomes high in cost. SOLUTION: In a joint structure between a power semiconductor module 10 and a heat sink 20, a plurality of joint fins 13b protruding into a direction inclined from a direction orthogonal to a joint surface is juxtaposed on a joint surface of the power semiconductor module 10, and a plurality of joint fins 20c protruding into a direction inclined to the same direction of the inclining direction of the joint fins 13b and which has a shape corresponding to a shape between the joint fins 13b is juxtaposed on a joint surface of the heat sink 20. A stiffness for any one base of the joint fin 13b and the joint fin 20c is configured to be smaller than that of a part other than the base. The power semiconductor module 10 and the heat sink 20 are connected in a state that each joint fin 13b and each joint fin 20c are engaged with each other to be joined. COPYRIGHT: (C)2009,JPO&INPIT |
