| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package capable of improving reliability by reinforcing the adhesiveness of a printed circuit board and a package for surface mounting, and a mounting method thereof. <P>SOLUTION: The semiconductor package 100 comprises a chip pad 110 where the semiconductor device 120 is placed and a lead terminal 130. At least one of the chip pad 110 and the lead terminal 130 or both of them comprise a plurality of grooves 160. A plurality of grooves 160 are formed in the lead terminal 130 and the chip pad 110 of the package 100 adhered to the printed circuit board 300 so as to increase the adhesive area of the package 100 to cream solder 200 and secure the higher reliability of solder bonding than that of a prior package. <P>COPYRIGHT: (C)2009,JPO&INPIT |
