发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide means for improving the electrical characteristic and stability of an electrode/silicon carbide interface or an oxide film (insulating film)/silicon carbide interface on a nonpolar surface of a silicon carbide epitaxial layer regardless of the defect density of a substrate in a semiconductor device using silicon carbide as the substrate. SOLUTION: A semiconductor device includes a semiconductor substrate composed of silicon carbide, a gate noninsulating film formed on the semiconductor substrate, and a gate electrode formed on the gate insulating film. A surface of connection of the semiconductor substrate surface to the gate insulating film is macroscopically in parallel with a nonpolar surface and microscopically includes a nonpolar surface and a polar surface. In the polar surface, one of an Si surface and a C surface is superior to the other. The semiconductor device includes a semiconductor substrate composed of silicon carbide and an electrode formed on the semiconductor substrate. A surface of connection of the semiconductor substrate surface to the electrode is macroscopically in parallel with a nonpolar surface and microscopically includes a nonpolar surface and a polar surface. In the polar surface, one of an Si surface and a C surface is superior to the other. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009123753(A) |
申请公布日期 |
2009.06.04 |
申请号 |
JP20070293258 |
申请日期 |
2007.11.12 |
申请人 |
HOYA CORP;KOBAYASHI HIKARI |
发明人 |
NAGASAWA HIROYUKI;HATTA NAOKI;KAWAHARA TAKAMITSU;KOBAYASHI HIKARI |
分类号 |
H01L29/78;H01L21/20;H01L29/47;H01L29/872;H01L29/94 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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