发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide means for improving the electrical characteristic and stability of an electrode/silicon carbide interface or an oxide film (insulating film)/silicon carbide interface on a nonpolar surface of a silicon carbide epitaxial layer regardless of the defect density of a substrate in a semiconductor device using silicon carbide as the substrate. SOLUTION: A semiconductor device includes a semiconductor substrate composed of silicon carbide, a gate noninsulating film formed on the semiconductor substrate, and a gate electrode formed on the gate insulating film. A surface of connection of the semiconductor substrate surface to the gate insulating film is macroscopically in parallel with a nonpolar surface and microscopically includes a nonpolar surface and a polar surface. In the polar surface, one of an Si surface and a C surface is superior to the other. The semiconductor device includes a semiconductor substrate composed of silicon carbide and an electrode formed on the semiconductor substrate. A surface of connection of the semiconductor substrate surface to the electrode is macroscopically in parallel with a nonpolar surface and microscopically includes a nonpolar surface and a polar surface. In the polar surface, one of an Si surface and a C surface is superior to the other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009123753(A) 申请公布日期 2009.06.04
申请号 JP20070293258 申请日期 2007.11.12
申请人 HOYA CORP;KOBAYASHI HIKARI 发明人 NAGASAWA HIROYUKI;HATTA NAOKI;KAWAHARA TAKAMITSU;KOBAYASHI HIKARI
分类号 H01L29/78;H01L21/20;H01L29/47;H01L29/872;H01L29/94 主分类号 H01L29/78
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