| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package module which is reduced in volume while improved in data storage capacity and data processing speed. SOLUTION: The semiconductor package module 500 includes a circuit board 100 including a substrate body 110 having a storage portion and a conductive pattern 120 formed on the substrate body 110, a semiconductor package 200 having a semiconductor chip, and a connection member 300 electrically connecting the conductive pattern 120 and a conductive terminal to each other. After the storage portion having a storage space is formed on the substrate body 110 of the circuit board 100 and the semiconductor package is stored in the storage portion, a connection terminal of the semiconductor package 200 and the conductive pattern 120 of the substrate body 110 are electrically connected to each other using the connection member to stack a plurality of semiconductor packages 200 on the one circuit board without increasing the thickness. COPYRIGHT: (C)2009,JPO&INPIT
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