| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which can prevent lowering of mounting reliability. SOLUTION: A printed wiring board 1 has an insulating layer, a conductor layer having a component mounting region A, laminated on the insulating layer with an electronic component 60 mounted, a first solder resist 40 applied on the conductor layer, a silk print 80 which is applied to an area near the component mounting region A on the first solder resist 40 and a second solder resist 50 applied to at least a periphery of the silk print 80 on the first solder resist 40. COPYRIGHT: (C)2009,JPO&INPIT
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