| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a conventional cooling device with inferior efficiency of removing heat from a package mounted with a heating electronic component generating heat by driving such as a semiconductor device. SOLUTION: In the cooling device 10 which cools the package 14, mounted with the semiconductor device 12 generating heat by being driven, by blowing cooling air to one surface side of the package 14, wherein fin plates 18a and 18a provided between a top plate 20 provided with a supply hole 22 and a flat bottom plate 16 mounted on the one surface side of the package 14 form a plurality of fluid passages 24 is formed in a peripheral portion direction of the package 14 so that the cooling air flows in the peripheral portion direction along the one surface side of the package 14, and the part from the supply hole 22 of the top plate 20 to a discharge hole is formed into a slope which is sloped from the bottom plate 16 so that the fluid passages 24 gradually increase in flow passage area toward the discharge hole. COPYRIGHT: (C)2009,JPO&INPIT
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