发明名称 |
Chemical-Mechanical Planarization Pad Having End Point Detection Window |
摘要 |
A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.
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申请公布号 |
US2009142989(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
US20080179359 |
申请日期 |
2008.07.24 |
申请人 |
INNOPAD, INC. |
发明人 |
LEFEVRE PAUL;HSU OSCAR K.;WELLS DAVID ADAM;ALDEBORGH JOHN ERIK;JIN MARC C. |
分类号 |
B24B49/04;B24B49/12;B24D3/00;B24D3/34;B24D18/00;B29C44/06;B29C65/70 |
主分类号 |
B24B49/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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