发明名称 |
BEVEL/BACKSIDE POLYMER REMOVING METHOD AND DEVICE, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM |
摘要 |
A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers include an inorganic layer and an organic layer. The bevel/backside polymer removing method includes mechanically destroying the multi-layered bevel/backside polymers and heating residues of the multi-layered bevel/backside polymers mechanically destroyed.
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申请公布号 |
US2009143894(A1) |
申请公布日期 |
2009.06.04 |
申请号 |
US20080268649 |
申请日期 |
2008.11.11 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SAKURAGI ISAMU;KITAMURA AKINORI;HIROKI TSUTOMU;SHINDO TAKEHIRO |
分类号 |
G06F17/00;B23K26/16;B24B1/00;B24B7/04 |
主分类号 |
G06F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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