发明名称 SOLDERING TIP, SOLDERING IRON, AND SOLDERING SYSTEM
摘要 A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.
申请公布号 US2009140028(A1) 申请公布日期 2009.06.04
申请号 US20070948544 申请日期 2007.11.30
申请人 NORDSON CORPORATION 发明人 FORTI MICHAEL S.;GAUGLER KEVIN W.;VIVARI, JR. JOHN A.;WHEELER KEITH
分类号 B23K1/00;B23K3/03;B23K3/06 主分类号 B23K1/00
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