| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the deformation of bonding wires during resin molding. <P>SOLUTION: A resin mold package has a structure of connecting a die pad 14 fastening a semiconductor chip 20 and an inner lead 15 formed in the vicinity of the semiconductor chip 20 by a bonding wire 22 and molding the connection part of the semiconductor chip by a resin. An inner lead part is provided with an electronic component 21 having a bonding pad 23 on the upper surface. To the semiconductor chip 20 and the inner lead 16a that is a connection object, the bonding wires 22A and 22B are bonded, with the bonding pad 23 of the electronic component 20 as a relay section. <P>COPYRIGHT: (C)2009,JPO&INPIT |
