| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and its production process that can allow two or more semiconductor packages to be easily laminated. <P>SOLUTION: This is a semiconductor device 1 in which two or more packages 3a and 3b are laminated in sequence on a primary wiring substrate 2. The primary wiring substrate 2 includes a primary connection pad 17 on its front surface. The packages 3a and 3b have secondary wiring substrates 8a and 8b, semiconductor chips 10a and 10b arranged on the secondary wiring substrates 8a and 8b, inclination parts 30a and 30b formed at the ends of the secondary wiring substrates 8a and 8b, and secondary connection pads 14a and 14b formed parallel with the inclination parts 30a and 30b. The primary connection pad 17 and the secondary connection pads 14a and 14b are electrically connected by wires 4a and 4b. <P>COPYRIGHT: (C)2009,JPO&INPIT |
