| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg for a polyimide resin-based printed wiring board which has flame retardancy without using a halogen element, has a high Tg, and does not cause environmental problems, and a metal-clad laminate. SOLUTION: The prepreg is obtained by impregnating a thermosetting resin varnish not containing a halogen element into a glass base material and drying the varnish, wherein the thermosetting resin varnish comprises (a) a polyimide resin prepolymer, (b) aluminum hydroxide, (c) an organosilane having at least one functional group which reacts with a hydroxy group at an end and having at least one 6-12C aryl group as a hydrocarbon group, and (d) a cyclic condensation product of 1-cyanoethyl-2-ethyl-imidazole as a curing accelerator. COPYRIGHT: (C)2009,JPO&INPIT |
