FILM FOR SEMICONDUCTOR, METHOD FOR PRODUCING FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a film for semiconductor wherein an adhesive layer, a first cohesive layer and a second cohesive layer are bonded together in this order and the peripheral portion of the second cohesive layer extends beyond the peripheral portion of the first cohesive layer. This film for semiconductor is used for cutting a semiconductor wafer by arranging the semiconductor wafer on a side of the adhesive layer which is opposite to the side on which the first cohesive layer is arranged, while bonding a wafer ring onto the peripheral portion of the second cohesive layer. This film for semiconductor is characterized in that the adhesive force A1 (cN/25 mm) of the first cohesive layer to the adhesive layer is lower than the adhesive force A2 (cN/25 mm) of the second cohesive layer to the wafer ring. Also disclosed is a semiconductor device characterized by being manufactured using such a film for semiconductor.