| 摘要 |
A coating/developing apparatus by which particles adhered on a semiconductor wafer are removed by a simple structure after resist coating and prior to immersion exposure or after immersion exposure and prior to development. Prior to the immersion exposure, the wafer is cleaned by using a nozzle part provided with slit-shaped parallel suction ports on the both sides of a cleaning liquid discharge port having a length equivalent to substantially the diameter of the wafer. The nozzle part is provided with a U-shaped part, which surrounds the circumference of the wafer, has cleaning liquid discharge ports on the inner sides of an upper plane part and a lower plane part on the both edge parts of the nozzle part, a suction port surrounding the liquid discharge port on the lower plane part, and a suction port on a side plane part. The wafer is cleaned after the immersion exposure and prior to the development by using the nozzle part. Since the cleaning liquid is sucked while being discharged onto the surface or the circumference part of the wafer, a cup around the wafer for recovering the cleaning solution is eliminated. As a result, a space required for the entire coating/developing apparatus can be saved. |
