| 摘要 |
A pad for chemical and mechanical polishing is provided to reduce maintenance costs by making a slurry flow into a tunnel groove which is exposed to the outside when a groove is worn. A plurality of grooves(110) are formed at one sides of a chemical and mechanical polishing PAD(100), and a plurality of gain tunnels is formed at the lower part of the chemical and mechanical polishing pad where the plural gain grooves are formed. The plural gain grooves and the plural gain tunnel are crossed each other, and a rotation shaft connected with a platen is connected with a motor and is turned by the motor. The wafer is closely adhered to the chemical and mechanical pad while being engaged with a disk head. |
