发明名称 SPUTTERING APPARATUS AND SPUTTERING METHOD
摘要 A sputtering apparatus and a sputtering method are provided to increase usage efficiency of a target material by generating plasma on target surface widely. A vertical magnet unit is made of a center vertical magnet(101) and a external vertical magnet(102), and the center vertical magnet is installed at the center of the rear side of a target(2). The external vertical magnet is installed at the other side of the target to be surrounded. A parallel magnet unit is made of an internal parallel magnet(103) and an external parallel magnet(104). The internal parallel magnet and the external parallel magnet surround the center vertical while being between the center vertical magnet and the external vertical magnet.
申请公布号 KR20090056851(A) 申请公布日期 2009.06.03
申请号 KR20080118253 申请日期 2008.11.26
申请人 PANASONIC CORPORATION 发明人 YAMAMOTO MASAHIRO;KOIWASAKI TAKESHI;MURAGISHI ISAO;YAMANISHI HITOSHI
分类号 H01L21/203 主分类号 H01L21/203
代理机构 代理人
主权项
地址