| 摘要 |
A method for manufacturing a printed circuit board and a carrier used for the method are provided to fix the board to a carrier closely by using pressure difference between an inner part and an outer part of the carrier. A carrier includes a base(1), a space(2), a plurality of adsorption holes(3), a vacuum suction hole(4) and a vacuum pump. A printed circuit board is laminated on a plate shaped base. The base is made of the material including the metal and resin. The space is formed in the base. The plurality of adsorption holes are formed in both sides of the base. The plurality of adsorption holes are connected to the space. The vacuum suction hole suctions the air of the space. The vacuum pump applies the negative pressure to the space through the vacuum suction hole.
|
