| 摘要 |
A substrate used to a semiconductor package is provided to prevent deformation of a substrate due to heat in forming sealing by making a cavity divided into multitude not being continued as one long. A plurality of cavities(212) are equipped at the center of a semiconductor package substrate(200), and a plurality of connection pads(214) are arranged at the lower-part of the substrate to the outer side of the cavity. A plurality of ball lands(216) includes an outer connection terminal on the outside of a connection pad, and a semiconductor having a plurality of bonding pads of center pad type is adhered to the substrate through a face down type. The cavity is divided as the same size or is divided as different sizes according to deformation of the cavity. |
