| 摘要 |
<p>A substrate treating apparatus is provided to transfer a plurality of substrates to a coating unit and a thermal treating unit without delay by receiving the substrate at a buffer temporally. In a substrate treating apparatus, a substrate processing apparatus comprises a film formation processing unit(3), a first periodic delivering apparatus (T1,T2), a replacing unit, and a buffer part. The film formation processing unit comprises an application process unit and a heat treatment unit. The first periodic transfer apparatus transfers a coating processing unit and a thermal treatment unit. The buffer is installed nearby a receiving unit and receives the substrate temporally.</p> |
