| 摘要 |
An apparatus and a method for controlling a position of a wafer using a magnetic sensor are provided to prevent damage to a wafer due to a position error of the wafer by loading/unloading the wafer at an exact position. A MP(Micro Planarizer)(10) comprises a polishing head(12a) and a polishing pad(14a). A spray station receives a wafer before/after loading/unloading the wafer about the MP. A transfer robot(15) loads/unloads the wafer between the MP and the spray station. A magnetic sensor(50) is included in one side of the MP and in one side of a robot arm of the transfer robot. The magnetic sensor senses an exact position of the wafer.
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