Semiconductor device vacuum package and manufacturing process thereof

摘要

A vacuum package (100) has a chamber (6) in which pressure is reduced to less than the atmospheric pressure, a functional component (1) sealed in the chamber (6), and a material forming at least a part of the chamber (6). The material has at least one through hole (13) to evacuate the chamber (6). In a cross section perpendicular to the material taken along the through hole (13), an edge portion of the material forming the through hole has an obtuse angle. The through hole is sealed with a sealing material (15).