| 摘要 |
A positive type photosensitive resin composition is provided to cause chemical change due to exposure, to form patterns by increasing a development rate of exposure region, to form a surface passivation layer and an interlayer insulating film with excellent heat resistance while minimizing the loss of resolution and sensitivity. A positive type photosensitive resin composition comprises a polyamide polymer represented by chemical formula 1; an esterified quinonediazide compound; a phenolic group-containing compound; and solvent. In chemical formula 1, X1 ~ X3 are independently divalent ~ tetravalent organic groups; Y1 ~ Y2 are independently divalent ~ hexavalent organic groups; E is residue induced from aldehyde; R1 ~ R2 are independently hydrogen or C1-5 organic groups; m1 and m2 are independently 0 ~ 100, wherein m1+m2 is 5 ~ 100; n1, n2 and n3 are independently an integer of 0 ~ 2, wherein n2 + n3 is an integer of 0 ~ 3. |
