发明名称 Memory module having on-package or on-module termination
摘要 A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the substrate, and at least one memory package mounted to the substrate and containing a memory die electrically connected to input/output leads located along the perimeter of the memory package and through which data signals are transmitted to and from the memory die. Data signal lines electrically connect a plurality of the input/output leads of the memory package to a plurality of the pins of the edge connector. Termination resistors individually electrically connect each of the data signal lines to ground, a supply voltage, or a reference voltage of the memory package so as to reduce noise and signal reflections through the data signal lines.
申请公布号 US7542305(B2) 申请公布日期 2009.06.02
申请号 US20050162029 申请日期 2005.08.25
申请人 OCZ TECHNOLOGY GROUP, INC. 发明人 PETERSEN RYAN M.;SCHUETTE FRANZ MICHAEL
分类号 H01R12/16 主分类号 H01R12/16
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