发明名称 |
Memory module having on-package or on-module termination |
摘要 |
A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the substrate, and at least one memory package mounted to the substrate and containing a memory die electrically connected to input/output leads located along the perimeter of the memory package and through which data signals are transmitted to and from the memory die. Data signal lines electrically connect a plurality of the input/output leads of the memory package to a plurality of the pins of the edge connector. Termination resistors individually electrically connect each of the data signal lines to ground, a supply voltage, or a reference voltage of the memory package so as to reduce noise and signal reflections through the data signal lines.
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申请公布号 |
US7542305(B2) |
申请公布日期 |
2009.06.02 |
申请号 |
US20050162029 |
申请日期 |
2005.08.25 |
申请人 |
OCZ TECHNOLOGY GROUP, INC. |
发明人 |
PETERSEN RYAN M.;SCHUETTE FRANZ MICHAEL |
分类号 |
H01R12/16 |
主分类号 |
H01R12/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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