发明名称 Method of foming a micromechanical structure
摘要 A method of forming a micromechanical structure, wherein at least one micromechanical structural layer is provided above a substrate. The micromechanical structural layer is sustained between a lower sacrificial silicon layer and an upper sacrificial silicon layer, wherein a metal silicide layer is formed between the lower and upper sacrificial silicon layers to increase interface adhesion therebetween. The upper sacrificial silicon layer, the metal silicide layer and the lower sacrificial silicon layer are then removed to release the micromechanical structural layer.
申请公布号 US7541280(B2) 申请公布日期 2009.06.02
申请号 US20040917362 申请日期 2004.08.13
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 PO CHING-HENG;WANG SHEN-PING;CHEN CHIA-CHIANG
分类号 H01L21/4763;H01L21/44 主分类号 H01L21/4763
代理机构 代理人
主权项
地址