发明名称 |
Method of foming a micromechanical structure |
摘要 |
A method of forming a micromechanical structure, wherein at least one micromechanical structural layer is provided above a substrate. The micromechanical structural layer is sustained between a lower sacrificial silicon layer and an upper sacrificial silicon layer, wherein a metal silicide layer is formed between the lower and upper sacrificial silicon layers to increase interface adhesion therebetween. The upper sacrificial silicon layer, the metal silicide layer and the lower sacrificial silicon layer are then removed to release the micromechanical structural layer.
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申请公布号 |
US7541280(B2) |
申请公布日期 |
2009.06.02 |
申请号 |
US20040917362 |
申请日期 |
2004.08.13 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
PO CHING-HENG;WANG SHEN-PING;CHEN CHIA-CHIANG |
分类号 |
H01L21/4763;H01L21/44 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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