发明名称 Thin film forming apparatus
摘要 When a solution sprayed by a spray nozzle portion reaches one surface portion of a substrate, a thin film forming material contained the solution decomposes thermally because the substrate is heated to a prescribed temperature, and a thin film is formed on the one surface portion of the substrate. An imaging section obtains a prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, and a main control section controls a valve section based on the prescribed information from the imaging section. Since, based on the prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, the main control section allows the spraying nozzle portion to spray the solution therefrom, a thin film of the desired thickness can be formed with high accuracy.
申请公布号 US7540922(B2) 申请公布日期 2009.06.02
申请号 US20040988218 申请日期 2004.11.12
申请人 SHARP KABUSHIKI KAISHA 发明人 OKADA HIDEO;IMANAKA TAKAO
分类号 B05C11/10;C03C17/00;C03C17/25;C23C18/02 主分类号 B05C11/10
代理机构 代理人
主权项
地址