发明名称 Triple alignment substrate method and structure for packaging devices
摘要 A method for aligning multiple substrates. The method includes providing a handle substrate, providing a spacer substrate, and forming a plurality of first alignment marks on a first surface of the handle substrate. The method also includes forming a plurality of self-limiting alignment marks on a first surface of the spacer substrate and forming a plurality of openings in the spacer substrate, each of the plurality of openings surrounded by standoff regions. The method further includes aligning the first surface of the handle substrate and the first surface of the spacer substrate using the first alignment marks and the self-limiting alignment marks and bonding the handle substrate to the spacer substrate to form a composite substrate structure. In a specific embodiment, the plurality of self-limiting alignment marks and the plurality of openings are formed using an anisotropic wet etching process that preferentially etches the spacer substrate.
申请公布号 US7542195(B2) 申请公布日期 2009.06.02
申请号 US20080033718 申请日期 2008.02.19
申请人 MIRADIA INC. 发明人 YANG XIAO
分类号 G02F1/03;H01L21/46 主分类号 G02F1/03
代理机构 代理人
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