发明名称 Trench diffusion isolation in semiconductor devices
摘要 A semiconductor structure is formed comprising a plurality of columns doped with alternating dopants. The columns are separated by trenches, and the dopant is diffused in the doped columns. The trenches are filled with semiconductor material. Other embodiments may be described and claimed.
申请公布号 US7541260(B2) 申请公布日期 2009.06.02
申请号 US20070677430 申请日期 2007.02.21
申请人 INFINEON TECHNOLOGIES AUSTRIA AG 发明人 PFIRSCH FRANK;RIEGER WALTER
分类号 H01L21/76 主分类号 H01L21/76
代理机构 代理人
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